US Patent 9187316 Ultrasonic sensor microarray and method of manufacturing same

Patent 9187316 was granted and assigned to University of Windsor on November, 2015 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

University of Windsor

Current Assignee

University of Windsor

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

91873160

Date of Patent

November 17, 2015

Patent Application Number

143312950

Date Filed

July 15, 2014

Patent Primary Examiner

‌

Reema Patel

Patent abstract

A sensor assembly including one or more capacitive micromachined ultrasonic transducer (CMUT) microarray modules which are provided with a number of individual transducers. The transducers include silicon device and backing layers joined by a fused benzocyclobutene (BCB) layer which defines the transducer air gap, and which are arranged to simulate or orient individual transducers in a hyperbolic paraboloid geometry. The transducers/sensor are arranged in a matrix and are activatable to emit and receive reflected beam signals at a frequency of between about 100 to 170 kHz.