US Patent 9147638 Interconnect structures for embedded bridge

Embodiments of the present disclosure are directed towards interconnect structures for embedded bridge in integrated circuit (IC) package assemblies. In one embodiment, a method includes depositing an electrically insulative layer on a bridge interconnect structure, the bridge interconnect structure including a die contact that is configured to route electrical signals between a first die and a second die, depositing a sacrificial layer on the electrically insulative layer, forming an opening through the sacrificial layer and the electrically insulative layer to expose the die contact and forming a die interconnect of the first die or the second die by depositing an electrically conductive material into the opening. Other embodiments may be described and/or claimed.