Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 29, 2015
Patent Application Number
13950904
Date Filed
July 25, 2013
Patent Citations Received
Patent Primary Examiner
Patent abstract
There is provided a power module semiconductor device allowing reduction in size and weight of a thin type SiC power module. The power module semiconductor device (1) includes: a ceramic substrate (10); a first pattern (D (K4)) of a first copper plate layer (10a) disposed on a surface of the ceramic substrate; a first semiconductor chip (Q4) disposed on the first pattern; a first pillar connection electrode (18o) disposed on the first pattern; and an output terminal (O) connected to the first pillar connection electrode.
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