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US Patent 9136236 Localized high density substrate routing

Patent 9136236 was granted and assigned to Intel on September, 2015 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Intel
Intel
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Date Filed
September 28, 2012
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Date of Patent
September 15, 2015
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Patent Application Number
13630297
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Patent Citations Received
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US Patent 12107042 Localized high density substrate routing
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US Patent 12080652 Microelectronic assemblies with communication networks
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US Patent 12087596 Controlling of height of high-density interconnection structure on substrate
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US Patent 12088050 Plug assembly and receptacle assembly with two rows
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US Patent 11749642 Microelectronic assemblies with communication networks
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US Patent 11764158 Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
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US Patent 11894311 Microelectronic device with embedded die substrate on interposer
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US Patent 11916020 Microelectronic assemblies with communication networks
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US Patent 11967580 Microelectronic assemblies with communication networks
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US Patent 11984396 Localized high density substrate routing
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9136236
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Patent Primary Examiner
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(Vikki) Hoa B Trinh
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