Log in
Enquire now
‌

US Patent 9106067 Ground bushing with three way lay and lag

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
91060670
Date of Patent
August 11, 2015
0
Patent Application Number
140216470
Date Filed
September 9, 2013
0
Patent Citations Received
‌
US Patent 12062881 Assembly for clamping and grounding objects
0
‌
US Patent D1000264 Conduit nipple grounding bushing
‌
US Patent 11929583 Assembly for clamping and grounding objects
0
Patent Primary Examiner
‌
Angel R. Estrada
0
Patent abstract

A ground bushing with a multi position lay and lag includes a lay and lag having several mounting surfaces for attachment of the lay and lag to the ground bushing in different positions. The bushing includes at least one mounting surface including indexing and the lay and lag includes at least two cooperating mounting surfaces to hold and position on the bushing. In one embodiment, the bushing includes one mounting surface with parallel grooves, and the lay and lag includes three cooperating mounting surfaces with cooperating parallel grooves. The lay and lag may include a smooth hole and the bushing may include a threaded hole for attaching the lay and lag to the bushing.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 9106067 Ground bushing with three way lay and lag

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.