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US Patent 9087764 Adhesive wafer bonding with controlled thickness variation

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 26, 2013
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Date of Patent
July 21, 2015
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Patent Application Number
13952450
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Patent Citations Received
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US Patent 12094851 Particle capture using transfer stamp
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US Patent 11981559 Enclosed cavity structures
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US Patent 12006205 Micro-device structures with etch holes
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US Patent 11670602 Secure integrated-circuit systems
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US Patent 11705439 LED color displays with multi-LED sub-pixels
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US Patent 11804431 Laser-formed interconnects for redundant devices
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US Patent 11834330 Enclosed cavity structures
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US Patent 11863154 Non-linear tethers for suspended devices
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US Patent 11881475 Modules with integrated circuits and devices
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US Patent 11884537 Enclosed cavity structures
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9087764
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Patent Primary Examiner
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Michelle Mandala
0

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