Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Young-Ju Lee0
Mun Yong Lee0
Date of Patent
June 23, 2015
0Patent Application Number
136296490
Date Filed
September 28, 2012
0Patent Primary Examiner
Patent abstract
A mold for hot stamping is disclosed. The mold for hot stamping according to an exemplary embodiment of the present invention may include an upper mold and a lower mold so as to stamp a heated blank having a welding portion. A recess may be formed at an upper forming surface in the upper mold corresponding to the welding portion of the blank and may define a cooling space between the recess and the blank such that a cooling fluid directly cools the welding portion of the blank after the blank is stamped.
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