Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Philippe M. Schick0
Ian Ashdown0
Michael A. Tischler0
Paul Jungwirth0
Calvin Wade Sheen0
Date of Patent
June 9, 2015
0Patent Application Number
144565730
Date Filed
August 11, 2014
0Patent Primary Examiner
0
Patent abstract
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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