Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Parthiban Arunasalam0
Joe Albert Ojeda, Sr.0
Date of Patent
April 21, 2015
0Patent Application Number
140607160
Date Filed
October 23, 2013
0Patent Primary Examiner
Patent abstract
A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication.
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