Is a
Patent attributes
Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jaydutt J. Joshi0
Date of Patent
April 14, 2015
0Patent Application Number
136748130
Date Filed
November 12, 2012
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Systems and methods for improving thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal collection layer can be formed on a surface of a flip chip die. The thermal collection layer can be configured to dissipate heat generated by the flip chip die. In some variations, the thermal collection layer can be constructed using materials having high thermal conductivity.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
