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US Patent 8916981 Epoxy-amine underfill materials for semiconductor packages

Patent 8916981 was granted and assigned to Intel on December, 2014 by the United States Patent and Trademark Office.

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US Patent 12132002 Bridge interconnection with layered interconnect structures
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US Patent 12094827 Size and efficiency of dies
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US Patent 11961804 Size and efficiency of dies
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Patent Inventor Names
Nachiket R. Raravikar0
Nisha Ananthakrishnan0
Yiqun Bai0
Yonghao Xiu0
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US Patent 11715695 Size and efficiency of dies
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US Patent 11694960 Bridge interconnection with layered interconnect structures
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=08916981
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US Patent 08916981 Epoxy-amine underfill materials for semiconductor packages US Patent 8916981 Epoxy-amine underfill materials for semiconductor packages

Infobox
Patent Number
08916981
Patent Number
8916981
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=08916981
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 US Patent 08916981 Epoxy-amine underfill materials for semiconductor packages

Infobox
Is a
Patent
Patent
Current assignee
Intel
Intel
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
08916981
Date of patent
December 23, 2014
Patent application number
13891475
Date Filed
May 10, 2013
Patent primary examiner
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Quoc Hoang

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