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US Patent 8901748 Direct external interconnect for embedded interconnect bridge package

Patent 8901748 was granted and assigned to Intel on December, 2014 by the United States Patent and Trademark Office.

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US Patent 12132002 Bridge interconnection with layered interconnect structures
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12087700 Embedded die microelectronic device with molded component
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US Patent 11990427 Chiplet first architecture for die tiling applications
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US Patent 11973041 Chiplet first architecture for die tiling applications
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US Patent 11948855 Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
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US Patent 11935907 Image sensor device
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US Patent 11894311 Microelectronic device with embedded die substrate on interposer
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US Patent 11791311 Electronic device
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US Patent 11769735 Chiplet first architecture for die tiling applications
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US Patent 11764177 Bonded structure with interconnect structure
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US Patent 11749606 Embedded bridge substrate having an integral device
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US Patent 11694960 Bridge interconnection with layered interconnect structures
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US Patent 08901748 Direct external interconnect for embedded interconnect bridge package US Patent 8901748 Direct external interconnect for embedded interconnect bridge package

Infobox
Patent Number
0890174800
Patent Number
890174800

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