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US Patent 8872321 Semiconductor packages with integrated heat spreaders

Patent 8872321 was granted and assigned to Broadcom (company) on October, 2014 by the United States Patent and Trademark Office.

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Patent

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Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8872321

Patent Inventor Names

Xiangdong Chen0

Kevin Kunzhong Hu0

Pieter Vorenkamp0

Rezaur Rahman Khan0

Sam Ziqun Zhao0

Sampath K. V. Karikalan0

Date of Patent

October 28, 2014

Patent Application Number

13404585

Date Filed

February 24, 2012

Patent Citations Received

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US Patent 12107042 Localized high density substrate routing

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US Patent 11984396 Localized high density substrate routing

Patent Primary Examiner

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Jasmine Clark

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