‌

US Patent 8803269 Wafer scale packaging platform for transceivers

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Date Filed
May 3, 2012
Date of Patent
August 12, 2014
Patent Application Number
13463408
Patent Citations Received
‌
US Patent 12124087 Wideband surface coupling
1
‌
US Patent 11782225 Multi-fiber interface apparatus for photonic integrated circuit
‌
US Patent 11835777 Optical multi-die interconnect bridge (OMIB)
2
‌
US Patent 11852876 Optical coupling
3
Patent Inventor Names
Bipin Dama
4
Kaushik Patel
4
Kishor Desai
4
Mark Webster
4
Prakash Gothoskar
4
Rao V. Yelamarty
4
Ravinder Kachru
4
Soham Pathak
4
Thomas Daugherty
4
Vipulkumar Patel
4
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8803269
Patent Primary Examiner
‌
Ida M. Soward

Find more entities like US Patent 8803269 Wafer scale packaging platform for transceivers

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.