Patent attributes
Provided is a stacked semiconductor package. The stacked semiconductor package of the present invention comprises: a substrate unit, which includes a connection substrate electrically connecting a first substrate having a contact pad and a second substrate having a contact pad; a first chip laminate at which a plurality of first semiconductor chips are stacked in multi-steps on the first substrate; a second chip laminate at which a plurality of second semiconductor chips are stacked in multi-steps on the second substrate; a first conductive wire which electrically connects a first bonding pad of the first semiconductor chip and the contact pad of the first substrate, a second conductive wire which electrically connects a second bonding pad of the second semiconductor chip and the contact pad of the second substrate, and a bonding unit which has a contact adhesive layer having a certain thickness, which is disposed between the first semiconductor chip in the top layer of the first chip laminate and the second semiconductor chip in the top layer of the second chip laminate, and which vertically stacks and bonds the first chip laminate and the second chip laminate.
