Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Suresh Belani0
Chung-Lin Wu0
Steven Sapp0
Sunggeun Yoon0
Bigildis Dosdos0
Date of Patent
May 13, 2014
0Patent Application Number
135840150
Date Filed
August 13, 2012
0Patent Primary Examiner
Patent abstract
The multi-chip leadless module 200 has integrated circuit (IC) 150, dual n-channel mosfet 110, IC leads 210, 211, 212, gate leads 213, 213, and source leads 217-220 encapsulated in resin 250. The IC 150 and the dual n-channel mosfet 110 are mounted face down on the leads. IC leads 210, 211, 212 are made of planar metal and connect, respectively, to the electrodes TEST, VDD and VM on the IC 150 using a flip chip technique to assemble the leads on copper pillars or copper studs.
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