Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Anindya Poddar0
Luu T. Nguyen0
Date of Patent
May 6, 2014
Patent Application Number
13304167
Date Filed
November 23, 2011
Patent Citations Received
Patent Primary Examiner
Patent abstract
In one aspect of the present invention, an integrated circuit package will be described. The integrated circuit package includes at least two integrated circuits that are attached with a substrate. The integrated circuits and the substrates are at least partially encapsulated in a molding material. There is a groove or air gap that extends partially through the molding material and that is arranged to form a thermal barrier between the integrated circuits.
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