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US Patent 8710649 Wafer level package and fabrication method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 5, 2013
Date of Patent
April 29, 2014
Patent Application Number
14019136
Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11927885 Fluoropolymer stamp fabrication method
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US Patent 11931855 Planarization methods for packaging substrates
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US Patent 11676832 Laser ablation system for package fabrication
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US Patent 11705365 Methods of micro-via formation for advanced packaging
0
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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
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US Patent 11862546 Package core assembly and fabrication methods
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US Patent 11881447 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8710649
Patent Primary Examiner
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Lex Malsawma

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