Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
John Herslow0
Date of Patent
March 18, 2014
Patent Application Number
13135139
Date Filed
June 27, 2011
Patent Citations Received
Patent Primary Examiner
Patent abstract
A card formed in accordance with the invention includes a first assembly comprised of multiple plastic layers attached via an adhesive to a metal layer. The multiple plastic layers forming the first assembly are laminated under a first selected temperature and pressure conditions to preshrink the multiple plastic layers, stress relieve the first assembly and render the first assembly dimensionally stable. The laminated first assembly is then attached to a metal layer via an adhesive layer to form a second assembly which is then laminated at a temperature below the first selected temperature to form a card which is not subjected to warpage and delamination.
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