US Patent 8664774 Bondwire configuration for reduced crosstalk

To protect victim bondwires in a packaged electronic component from crosstalk induced by noisy aggressor bondwires, shielding bondwires are configured between the victim bondwires and the aggressor bondwires. The shielding bondwires, on either side of the victim bondwires, are connected to the same reference voltage on the package side of the component and to each other on the die side of the component, e.g., via a metal connection mounted on the die. As configured in one embodiment, the shielding bondwires and metal connection form a two-dimensional Faraday cage that shields the victim bondwires from crosstalk induced by the aggressor bondwires.