US Patent 8631687 Indenter assembly

An indentation assembly for sub-micron testing includes an indentation tip and a tip holder coupled with the indentation tip. The tip holder includes a first thermal conductivity and a first coefficient of thermal expansion. A tip holder mount configured for coupling with a transducer and the tip holder, the tip holder mount having a second thermal conductivity greater than the first thermal conductivity, and the tip holder mount has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion. The tip holder mount has a mount length, and the tip holder further has a tip holder length greater that the mount length. The tip holder remotely positions the tip holder mount relative to the indentation tip. The tip holder length, volume and the first thermal conductivity cooperate to throttle heat transfer through the tip holder prior to reaching the tip holder mount.