‌

US Patent 8623700 Inter-chip communication

Patent 8623700 was granted and assigned to University of Notre Dame on January, 2014 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

Patent

Patent attributes

Current Assignee

University of Notre Dame

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8623700

Date of Patent

January 7, 2014

Patent Application Number

11599283

Date Filed

November 15, 2006

Patent Citations Received

‌

US Patent 11894322 Launch structures for radio frequency integrated device packages

Patent Primary Examiner

‌

Zandra Smith

Patent abstract

The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 8623700 Inter-chip communication

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API