US Patent 8604359 Package substrate and fabrication method thereof
Patent 8604359 was granted and assigned to Unimicron Technology on December, 2013 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 23, 2011
Date of Patent
December 10, 2013
Patent Application Number
13241264
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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