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US Patent 8588561 Transceiver and interface for IC package

Patent 8588561 was granted and assigned to Samtec Inc on November, 2013 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Samtec Inc

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8588561

Date of Patent

November 19, 2013

Patent Application Number

13539173

Date Filed

June 29, 2012

Patent Citations Received

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US Patent 12069778 Devices, systems and methods for electrical utility submetering

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US Patent 11842138 Integrated routing assembly and system using same

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US Patent 11996654 Controlled-impedance compliant cable termination

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US Patent 11677188 Controlled-impedance compliant cable termination

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US Patent 11688960 Routing assembly and system using same

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US Patent 11764523 Very high speed, high density electrical interconnection system with impedance control in mating region

Patent Primary Examiner

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Sarah Hahm

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