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US Patent 8558540 Method of measuring dimensionless coupling constant of magnetic structure

Patent 8558540 was granted and assigned to National Yunlin University of Science and Technology on October, 2013 by the United States Patent and Trademark Office.

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Patent
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Patent attributes

Current Assignee
National Yunlin University of Science and Technology
National Yunlin University of Science and Technology
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
85585400
Date of Patent
October 15, 2013
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Patent Application Number
132539860
Date Filed
October 6, 2011
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Patent Citations Received
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US Patent 11940487 Thermal solution for massively parallel testing
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US Patent 11835549 Thermal array with gimbal features and enhanced thermal performance
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US Patent 11841392 Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
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US Patent 11852678 Multi-input multi-zone thermal control for device testing
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US Patent 11656273 High current device testing apparatus and systems
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US Patent 11674999 Wafer scale active thermal interposer for device testing
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US Patent 11754620 DUT placement and handling for active thermal interposer device
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US Patent 11774492 Test system including active thermal interposer device
Patent Primary Examiner
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Patrick Assouad
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