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US Patent 8466054 Thermal conduction paths for semiconductor structures

Patent 8466054 was granted and assigned to IO Semiconductor on June, 2013 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
‌
IO Semiconductor
Date Filed
December 5, 2011
Date of Patent
June 18, 2013
Patent Application Number
13311454
Patent Citations Received
‌
US Patent 12113069 Thermal extraction of single layer transfer integrated circuits
0
‌
US Patent 11676880 High thermal conductivity vias by additive processing
0
‌
US Patent 11996343 Thermal routing trench by additive processing
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8466054
Patent Primary Examiner
‌
Ngan Ngo

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