Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sang-Yun Lee0
Date of Patent
June 4, 2013
Patent Application Number
12847374
Date Filed
July 30, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor circuit structure includes an interconnect region, and a material transfer region. The semiconductor circuit structure includes a conductive bonding region which couples the material transfer region to the interconnect region through a bonding interface. The conductive bonding region includes a barrier layer between a conductive layer and bonding layer. The bonding layer is positioned towards the material transfer region, and the conductive layer is positioned towards the interconnect region.
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