Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 9, 2013
Patent Application Number
12796867
Date Filed
June 9, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit card includes a laminate, solder bumps, a die and a package. The laminate includes a core board sandwiched between two conductive layers. The conductive layers are connected to each other with solder bumps filled in apertures defined in the core board. The die is provided on one of the conductive layers. The package is provided on the die and an area of the conductive layer around the die.
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