Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sang-Yun Lee0
Date of Patent
February 5, 2013
0Patent Application Number
128819610
Date Filed
September 14, 2010
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of forming a semiconductor structure includes coupling a semiconductor structure to an interconnect region through a bonding region. The interconnect region includes a conductive line in communication with the bonding region. The bonding region includes a metal layer which covers the interconnect region. The semiconductor structure is processed to form a vertically oriented semiconductor device.
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