Patent attributes
A tile cutting machine includes a tub for receiving water and a tile supporting surface for supporting thereon a tile to be cut. A cutting head assembly is positioned above the tile supporting surface and includes a motor driven blade. A tile hold down mechanism extends downwardly from the cutting head assembly to engage the tile and apply downward pressure thereto to hold the tile in place during the cutting process. The tile hold down mechanism may take the form of flexible hold down feet, downwardly biased rollers and/or bristle skirts. The tile supporting surface may be fabricated of a high friction material and include a plurality of nubs to cooperate with the hold down mechanism to hold the tile stationary with respect to the supporting surface during the cutting process. The tile cutting machine provides for a method of cutting tile where a user does not have to hold the tile with their hands during the cutting operation.
