Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Anil Yadav0
Rajesh Bajaj0
Sanjeev Kumar Jain0
Date of Patent
January 29, 2013
Patent Application Number
12982168
Date Filed
December 30, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present disclosure is directed to a semiconductor die having a chip outline boundary, a die seal, a row of input/output contact pads separated from the chip outline boundary by the die seal, a first row of solder bump connections positioned between the row of input/output contact pads and the die seal, and a second row of solder bump connections separated from the first row of solder bump connections by the row of input/output contact pads.
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