US Patent 8324728 Wafer level packaging using flip chip mounting
Patent 8324728 was granted and assigned to Skyworks Solutions on December, 2012 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 25, 2008
Date of Patent
December 4, 2012
Patent Application Number
12740922
Patent Inventor Names
Behnam Tabrizi
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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