US Patent 8319338 Thin stacked interposer package

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Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8319338

Date of Patent

November 27, 2012

Patent Application Number

12832202

Date Filed

July 8, 2010

Patent Citations Received

‌

US Patent 12107042 Localized high density substrate routing

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US Patent 11869875 Electronic device having a substrate-to-substrate interconnection structure and manufacturing method thereof

‌

US Patent 11984396 Localized high density substrate routing

‌

US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing

‌

US Patent 11804475 Semiconductor package for thermal dissipation

Patent Primary Examiner

‌

Matthew Reames

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