US Patent 8304895 Semiconductor package and method of fabricating the same

Patent 8304895 was granted and assigned to Electronics and Telecommunications Research Institute on November, 2012 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Electronics and Telecommunications Research Institute

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

83048950

Patent Inventor Names

Hae Cheon Kim0

Eun Soo Nam0

Soon Il Yeo0

Woojin Chang0

Date of Patent

November 6, 2012

Patent Application Number

127643300

Date Filed

April 21, 2010

Patent Citations Received

‌

US Patent 11889950 Cooking device and components thereof

Patent Primary Examiner

‌

Matthew E Warren

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