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US Patent 8304293 Thermally enhanced semiconductor package

Patent 8304293 was granted and assigned to Maxim Integrated on November, 2012 by the United States Patent and Trademark Office.

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Patent Inventor Names

Tarak A. Railkar0

Steven D. Cate0

Date of Patent

November 6, 2012

Patent Application Number

132302080

Date Filed

September 12, 2011

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