Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Matthew Ming Fai Yuen0
Bing Xu0
Cheng Yang0
Date of Patent
July 31, 2012
Patent Application Number
12453810
Date Filed
May 22, 2009
Patent Primary Examiner
Patent abstract
An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.
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