An electrical grounding device includes a first collar member having first inner and outer wall surfaces, a first flange projecting from the first inner wall surface, and a first shoulder projection extending radially from the first outer wall surface. The device further includes a second collar member having second inner and outer wall surfaces, a second flange projecting from the second inner wall surface, and a second shoulder projection extending radially from the second outer wall surface. Further, the device includes a thickened wall region including an aperture passing transversely therethrough, wherein the thickened wall region is disposed in the outer wall surface of at least one of the first and second collar members. A fastener is operably associated with the first and second shoulder projections to removably couple the first and second shoulder projections together. Such coupling configures the first and second inner wall surfaces to define an opening disposed through the electrical grounding device.