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US Patent 8191018 Methods and software for printing materials onto a substrate

Patent 8191018 was granted and assigned to Kovio on May, 2012 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Current Assignee
Kovio
Kovio
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
81910180
Patent Inventor Names
Patrick Smith0
Erik Scher0
Michael Kocsis0
Steven Molesa0
Date of Patent
May 29, 2012
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Patent Application Number
121754230
Date Filed
July 17, 2008
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Patent Citations Received
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US Patent 12083595 Method and apparatus for forming overhanging structures in additive manufactured parts that have an improved surface roughness
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US Patent 11972194 Method for determining patterning device pattern based on manufacturability
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Patent Primary Examiner
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Phallaka Kik
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Patent abstract

Methods and software for correcting printable circuit layouts. The methods generally including steps of identifying shapes in an input circuit layout, applying a plurality of correction rules to the shapes, and producing an output printed circuit layout in accordance with the identified shapes and the correction rules. The input circuit layout generally comprises a bitmapped image or other description of at least one printable layer of at least one electronic component, device, or die. Embodiments of the present invention further allow for more precise control of spreading and effective coverage of features (e.g., source/drain terminal regions, gates, capacitors, diodes, interconnects, etc.) on a substrate by a printed ink composition including electronic materials.

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