Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mark Chou0
Chien-Kang Chou0
Michael Chen0
Mou-Shiung Lin0
Date of Patent
May 29, 2012
0Patent Application Number
117566210
Date Filed
May 31, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
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