US Patent 8123460 UAV pod cooling using integrated duct wall heat transfer

Electronic equipment frequently requires cooling to maintain the integrity and reliability of the equipment, and to elongate the life expectancy of the equipment. When in operation, the fan of a UAV creates airflow comprising outside air directed across the duct of the UAV. Utilizing this airflow generated by the fan of a UAV to provide heat transfer from a equipment enclosure accomplishes efficient heat transfer. The methods described herein for transferring heat from an equipment enclosure using an airflow generated by a fan of a UAV may be employed for UAVs having a variety of duct shapes, and having equipment enclosures inside the duct or in detachable equipment enclosures located on the duct of the UAV.