US Patent 8120153 High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module
Patent 8120153 was granted and assigned to University of Central Florida on February, 2012 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 14, 2006
Date of Patent
February 21, 2012
Patent Application Number
11521176
Patent Inventor Names
Zheng John Shen
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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