US Patent 8118938 Lower liner with integrated flow equalizer and improved conductance
Patent 8118938 was granted and assigned to Applied Materials on February, 2012 by the United States Patent and Trademark Office.
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Patent abstract
A plasma processing chamber has a lower liner with an integrated flow equalizer. In an etching process, the processing gases may be unevenly drawn from the processing chamber which may cause an uneven etching of the substrate. The integrated flow equalizer is configured to equalize the flow of the processing gases evacuated from the chamber via the lower liner.
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US Patent 08118938 Lower liner with integrated flow equalizer and improved conductance US Patent 8118938 Lower liner with integrated flow equalizer and improved conductance
Infobox
Patent Number
0811893800
Patent Number
811893800
Edits on 27 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
081189380
Date of Patent
February 21, 2012
0Patent Application Number
131918500
Date Filed
July 27, 2011
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
081189380
Date of Patent
February 21, 2012
0Patent Application Number
131918500
Date Filed
July 27, 2011
0Patent Primary Examiner
Edits on 14 Dec, 2021
Golden AI
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Infobox (+8 properties)
US Patent 08118938 Lower liner with integrated flow equalizer and improved conductance
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08118938
Date of patent
February 21, 2012
Patent application number
13191850
Date Filed
July 27, 2011
Patent primary examiner
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