US Patent 8114262 Thickness distribution control for electroplating

Patent 8114262 was granted and assigned to Sipix Imaging on February, 2012 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

All edits

Edits on 28 Nov, 2023

"Add patent abstract"

Golden AI

edited on 28 Nov, 2023

Edits made to:

Article (+537 characters)

Article

Patent abstract

The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resistance, and ampere-hour meters. The invention is further directed to methods for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object. The object can be of any shape as long as it can electrically charged.

Edits on 20 Sep, 2023

"Add patent inventor(s)"

Golden AI

edited on 20 Sep, 2023

Edits made to:

Infobox (+2 properties)

Infobox

Patent Inventor Names

Gary Yih-Ming Kang0

Yi-Shung Chaug0

Edits on 24 May, 2023

"update inverses"