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US Patent 8097399 Photocurable compositions

Patent 8097399 was granted and assigned to 3D Systems on January, 2012 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
3D Systems
3D Systems
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8097399
Date of Patent
January 17, 2012
Patent Application Number
10593746
Date Filed
March 21, 2005
Patent Citations Received
‌
US Patent 11850803 Methods for producing three-dimensional objects with apparatus having feed channels
0
‌
US Patent 11707893 Methods for producing three-dimensional objects with apparatus having feed channels
0
Patent Primary Examiner
‌
Cynthia Hamilton
Patent abstract

An optical moulding process is disclosed comprising the sequential steps of: (a)(y) forming a layer of a photocurable composition; and (bXz) irradiating selected areas of the composition in the layer with radiation from a radiation source, thereby curing the composition in said selected areas and repeating the steps a) and b) on top of an earlier cured layer to form a three dimensional structure, wherein the radiation source used in step b) is a non-coherent source of radiation and wherein the photocurable composition comprises at least two curable components: (i) 45%-95% (and preferably at least 50%, more preferably at least 60%, e.g. at least 70%) by weight of the total curable components in the composition is a first component that is photocurable and that is such that, when cured in the presence of a photocuring initiator by exposure to UV radiation having an energy of 30 mJ/cm2, at least 90% of the component is cured within 50 milliseconds; and (ii) 5% to 55% (and preferably 10-40%, more preferably 15 to 30%, e.g. about 20%) by weight of the total curable components in the composition is a second component that results in the composition, on curing, shrinking, in a linear direction, by less than 3% and preferably that results in the composition having, after cure, a Tg of greater than 50° C., preferably at least 100° C. and more preferably at least 120° C.

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