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US Patent 8083853 Plasma uniformity control by gas diffuser hole design

Patent 8083853 was granted and assigned to Applied Materials on December, 2011 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Current Assignee
Applied Materials
Applied Materials
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
80838530
Patent Inventor Names
Ki Woon Kim0
Beom Soo Park0
John M. White0
Li Hou0
Qunhua Wang0
Robin L. Tiner0
Shinichi Kurita0
Soo Young Choi0
...
Date of Patent
December 27, 2011
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Patent Application Number
108896830
Date Filed
July 12, 2004
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Patent Citations Received
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US Patent 11859284 Shower head structure and plasma processing apparatus using the same
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US Patent 11915950 Multi-zone semiconductor substrate supports
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US Patent 12000047 Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
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US Patent 11692268 Gas diffusion shower head design for large area plasma enhanced chemical vapor deposition
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US Patent 12009228 Low temperature chuck for plasma processing systems
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US Patent 12116669 Integrated showerhead with improved hole pattern for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
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US Patent 11680321 Apparatus and method for semiconductor fabrication
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Patent Primary Examiner
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Jeffrie R. Lund
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Patent abstract

Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.

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