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US Patent 8069560 Method of manufacturing multilayer wiring board

Patent 8069560 was granted and assigned to Dai Nippon Printing on December, 2011 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Dai Nippon Printing
Dai Nippon Printing
Date Filed
February 18, 2010
Date of Patent
December 6, 2011
Patent Application Number
12708280
Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11862546 Package core assembly and fabrication methods
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US Patent 11705365 Methods of micro-via formation for advanced packaging
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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
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US Patent 12016119 Method for manufacturing multilayer printed circuit board
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US Patent 11676832 Laser ablation system for package fabrication
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US Patent 11881447 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
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US Patent 11927885 Fluoropolymer stamp fabrication method
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US Patent 11931855 Planarization methods for packaging substrates
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Patent Inventor Names
Koichi Nakayama
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Kazunori Nakamura
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Miyuki Akazawa
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Satoru Kuramochi
0
Toshiaki Mori
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8069560
Patent Primary Examiner
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Thiem Phan

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