US Patent 8035192 Semiconductor device and manufacturing method thereof
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Patent abstract
A semiconductor device has a semiconductor chip and through electrodes formed passing through the semiconductor chip. A ground layer connected to the through electrode and a patch antenna connected to the through electrode are provided through an inorganic insulating layer formed of SiO2 or SiN on a second face opposite to a first face (main face) of the semiconductor chip.
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US Patent 08035192 Semiconductor device and manufacturing method thereof US Patent 8035192 Semiconductor device and manufacturing method thereof
Infobox
Patent Number
0803519200
Patent Number
803519200
Edits on 28 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
080351920
Date of Patent
October 11, 2011
0Patent Application Number
123427550
Date Filed
December 23, 2008
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
080351920
Date of Patent
October 11, 2011
0Patent Application Number
123427550
Date Filed
December 23, 2008
0Patent Primary Examiner
Edits on 14 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 08035192 Semiconductor device and manufacturing method thereof
Infobox
Is a
Patent jurisdiction
Patent number
08035192
Date of patent
October 11, 2011
Patent application number
12342755
Date Filed
December 23, 2008
Patent primary examiner
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