US Patent 8018049 Silicon condenser microphone and manufacturing method

A silicon condenser microphone package and method for manufacture are disclosed. The silicon condenser microphone package includes a silicon condenser microphone die, a substrate comprising a conductive layer, and a cover having a conductive layer, where the conductive layers of the substrate and cover are electrically connected to form an electromagnetic interference shield for the silicon condenser microphone die. The method for manufacturing the silicon condenser microphone package involves placement of a plurality of silicon condenser microphone dies on a panel of printed circuit board material, placement of covers over each of the silicon condenser microphone dies, and then separating the panel into individual packages.