Patent attributes
Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink.
