Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 23, 2011
Patent Application Number
12892122
Date Filed
September 28, 2010
Patent Primary Examiner
Patent abstract
The present invention provides a semiconductor-device copper-alloy bonding wire which has an inexpensive material cost, ensures a superior ball joining shape, wire joining characteristic, and the like, and a good loop formation characteristic, and a superior mass productivity. The semiconductor-device copper-alloy bonding wire contains at least one of Mg and P in total of 10 to 700 mass ppm, and oxygen within a range from 6 to 30 mass ppm.
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